News & Public Relations

Ricmar Technology delivers first Wafer Pack Aligner for Wafer Level Burn In Process

Ricmar delivers first high sophisticated Wafer Pack Aligner WPA 1000 for a main supplier in Germany within the Automotive Industry.

For the production of magnetic field sensors within the Automotive industry it is necessary to run a Wafer Level Burn In (WLBI) process to detect early breakdown of the sensor function. The wafer pack align process is an important step within the WLBI to provide reliability and function of the sensors.

The WPA 1000 meets all customer specific requirements regarding treacebility, accuracy and throughput.

PROVAC AG sells business of Consumables for the Electron Microscopy Preperation Technology line to BALTIC PRÄPARATION

As of October 15th 2009 Baltic Präparation, Niesgrau/Germany takes over the business of Consumables for the Electron Microscopy Preparation Tecnology from Provac AG, Balzers.

For many years Provac AG was a reliable partner for sales of consumables for the Elctron Microscopy Preparation Technology and we would like to thank our customers for the good cooperation and the trust in our company. Mrs. Claudia Köster from BALTIC PRÄPERATION will be the new contact for any future inquiries.

For further information please contact:
Claudia Köster
Baltic Präperation
Koppelheck 34B
D-24395 Niesgrau
Germany

Phone: +49 4643 18 65 43
e-mail: baltic.praeparation@t-online.de

ISMI 450 mm Program Moving to Next Stage in addition to existing NanoPhotonics metrology tools

The ISMI 450 mm wafer program is moving to a new stage, going beyond wafer handling to blanket film deposition and metrology, said ISMI 450 mm program manager Tom Jefferson. Speaking at the close of the ISMI Symposium in Austin, Texas, Jefferson said the program will install a wafer cleaning tool next week, and is sending out single-crystal test wafers to equipment suppliers.

David Lammers, News Editor -- Semiconductor International, 10/23/2009