RSL 6000 Laser Sublimation System UV-Laser
Performance
- High precision, damage free Laser Stripping and Cutting System
- Substrates of up to 200 x 200 mm or up to 8” wafers
- Processing speed: up to 4000 mm/s (scanning setup) or 1000 mm/s (moving substrate setup)
- Cleanroom capability: up to US-Fed. class 1000
- UV-Laser in standard setup, customer specific wafelengths possible
- Scanning Laser beam setup (for cutting complex geometries) and fixed beam, moving substrate setup (for cutting straight lines) incorporated into one system
- Customer specific I/O-systems and for automatic loading and unloading of substrates
