Details
Core competencies
Our specialists can look back on long-term experience in customized solutions and wafer/substrate handling. Our systems are optimized to handle fragile and warped wafers and we focus on especially gentle handling of substrates, carriers and wafers.
Performance
- Handling reliability
- Handling of warped substrates
- Fully automatic processing of magazines based on customer recipy
- Integrated SPS-control
- Integrated sensors for wafer/substrate mapping, slide out, magazine present
- Transport height due to SMEMA standard
- Compact modules
- Fully safety integration without interlock circuits