Micro Part Taping Equipment MPT 1000
Application
The main requirements of the Micro Part Taper are the gentle handling of small and sensitive parts by picking up the dies from the wafer and gentle and safe positioning of the dies into tape caveties and sealing of the blister tapes.
The result of the automated process are packed dies within a sealed blister tape, traceability file and wafer with inked and mapped bad dies.
Highlights
- Pick & Place from wafer
- Gentle and safe positioning of dies into tape caveties
- Sealing of blister tapes
- Automatic Optical Inspection (inked and mapped bad dies, traceability)
- Non-piercing eject system
- Double pickup tool for simultaneous process steps