Chip Testing Equipment CTE 1000
Application
The customized equipment is designed for fully automatic handling and electrical testing of high voltage components out of waffle packs. The feeding and presenting of the chips out of stacks runs fully automatic as well as the sorting and seperating of the components into good/bad waffle trays right after the measurement.
Design
- Pick & Place from Waffle Pack (Substrate Carrier)
- Feeding and Presenting of chips out of stacks
- Automatic and very accurate positioning into testing unit
- Optical inspcetion of part geometry and good/bad die testing and sorting based on quality criterions
- Handling of small and sensitive parts/dies
- Twin-head pickup tool and parallel work flow for higher throughput
