REFLEX AF
Automatic 300 mm Wafer Inspection: Front Side, Edge and Back Side
| Features | Benefits |
|
- 300 and 200 mm silicon and 200 mm glass - Image based edge and notch inspection - Laser based surface inspection - Automatic Defect Classification (ADC) |
-- Flexible tool configuration - Technology upgradeable - Replaces operator go/no-go decision - Low cost of ownership |
Application
Total wafer inspection is a today’s demand for quality wafer production. The REFLEX AF series modular platform matches different customer requirements in a high volume production environment. Customer oriented solutions such as defect inspection in bare wafer and IC manufacturing in particle sensitive processes relay on the flexibility of the modular system.
Examples are particle monitoring in after metallization processes in BEOL or defect inspection on glass wafers prior to bonding steps. In 300 mm wafer manufacturing the high volume manufacturing proven Reflex AF EBI system in combination with a highly efficient Automatic Defect Classification enables the replacement of visual inspection.
Design
The REFLEX AF defect inspection tools are based on the WTT 300 Wafer Transfer Tool robotic platform, with load ports for either 200 mm or 300 mm wafers (FOUP or OCL input and/or output). The WTT 300, which is able to serve up to three input/outputs, automatically transfers the wafers in between the load port and the metrology module.
The core of the system consists of self contained metrology modules of the MetriCube® MC series. They can be equipped with up to two defect inspection modules for front side, back side and/or edge inspection. The upside down configuration of the back side inspection device enables measurement of the wafer back side without wafer flipping. Depending on the configuration, the defect inspection detects and classifies particles, scratches, area defects and haze on the wafer front or back side by using a high sensitive dark field laser technology. On the wafer edge defects like particles, scratches, area defects, cracks and chip-outs are detected by
a CCD based edge inspection technology providing dark field and bright field images in all zones of the edge of the wafer including the notch. True edge
gripping with no contact on the wafer surface side enables the usage in high end applications like end of line inspection in wafer production.
The powerful real time Automatic Defect Classification (ADC) software automatically classifies defects on the back side and the full edge including
the notch with automated wafer grading based on customer specific criteria. The technology enables the replacement of the operator in high volume
bare wafer manufacturing.
REFLEX AF series
The flexibility of the REFLEX AF system enables to combine various numbers of inspection units (MetriCubes®) and measurement applications that fi t customer’s needs.
REFLEX AF FSI – Front Side Inspection
- Front side defect inspection of 200 and 300 mm Si wafers and 200 mm glass wafers
REFLEX AF BSI – Back Side Inspection
- Back side defect inspection of 300 mm Si wafers
- Laser dark fi eld back side inspection
- No wafer fl ipping
REFLEX AF EI – Edge Inspection
- Edge inspection of 300 mm Si wafers
- CCD edge inspection with 360° image of total wafer edge
- Notch inspection
REFLEX AF EBI – Edge & Back Side Inspection
- Concurrent edge and back side inspection
- True edge gripping
- Real time ADC for edge and back side defects
REFLEX AF TWI – Total Wafer Inspection
- Concurrent edge and back side inspection
- Front side defect inspection
Options
Platform finishing stainless steel with 3D mirror sheets
Automatic cassette ID reader
Customized ADC
