Wafer Handling System - Series 300

• Fully automated modular and cost efficient system for < 200mm up to 300 mm wafers
• Smart and flexible design
• Stand alone or inline system
• Very small footprint (0,86m² without load port)
• 3-7 configurable load ports (all standard BOLTS compatible) depending on system
• Up to 2 OEM/BEOL (back end of line) tools
• Lowest cost of ownership and maintenance free
• Highly customized recipe management

The Wafer Handling System (WHS) Series 300 is unique in providing an extremely smart design and very small footprint. The flexible system is configurable from 3 to 7 configurable load ports depending on the type of the machine WHS 303, WHS 305 or WHS 307 and configuration.

The WHS is also designed to serve as an input/output device for loading wafers into the process tool, or any chuck and communicates with the host server. The systems include all communcation functionalities between different OEM tools such as SECS-GEM, ASCII, TCPIP, SMEMA which are used within the semiconductor industry. High reliability is guaranteed due to low particle generation by using a high-speed maintenance free clean class 1 robot.

The machine is equipped with BOLTS interfaces, allowing for the integration of all commercially available, as well as, custom load port types plus optionally a Ricmar Packer Load Port.

The pre-aligner is integrated into the Wafer Handling System platform and delivers exact X/Y alignment of the wafer. This includes flat/notch positioning of the laser scribes so they may be read using an OCR/BCR vision system for wafer identification.

A class 1 laser scanning system resides on the robots's arm, prividing fast and highly accurate map of the wafers in the cassettes for complete traceability independently from cassette type.

Optionally, the system can be equipped with, green light inspection and ionizer, fan filter unit, a.s.o.

The system is capable to run 200mm and 300 mm wafers corresponding conversion kits for 150mm are available as options, all known interleaf/foam materials and different end-effector types (HVF Vacuum, Taiko, Bernoulli,...) can be used depending on the customer application.

The Wafer Handling System Series 300 provides the highest possible throughput. This depends on the configuration and method used to hold the substrates. Ricmar's application team will be available to analyze your requirements and substrates to find the most cost efficient and fastest method of solving your handling/sorting/packing needs.

The equipment can be used to pack and/or unpack wafers from cassettes into canisters (flat packs), and pack/unpack from cassettes/canisters to and from wafer jars or pack to pack sequences and has full sorting and handling capabilities.

The Ricmar Wafer Packer Load Port incorporates five shuttles for up to two different wafer packs (200 and/or 300mm wafers), interleaf, foam and an additional trash box.

The processed material is presented to the rob by the individual shuttles and two functions, like pre-aligning and wafer handling are running simultaneously.