For the production of magnetic field sensors within the Automotive industry it is necessaryto run a Wafer Level Burn In (WLBI) process to detect early breakdown of the sensor function. The wafer pack align process is an important step within the WLBI to provide reliability and function of the sensors.
The WPA 1000 meets all customer specific requirements regarding treacebility, accuracy and throughput.
The WPA 1000 Wafer Pack Aligner is designed for the automatic probe to Pad Alignment (PTPA) on Wafer Level. The wafers are handled automatically from the magazines to the probe to pad station using OCR and pre-aligner.
After the external wafer level burn in process the wafers are again unloaded and placed into the transport magazines to be taken by the operator.